Precision Ceramic Industry
Professional supplier of electronic screen printing solutions
MLCC
By stacking ceramic media and metal electrodes, chip capacitors with small volume and large capacity are formed. Almost all circuit boards are equipped with MLCC, which is used to reduce noise and set circuit parameters.
MLCC process
Internal structure
Screen printing process
Using a scroll shaped ceramic film to continuously print the same pattern
Cut the continuously printed pattern into sections and then stack them together
Cut the stacked film into chips one by one
SMD Fuse
SMD Fuse are a relatively high-tech variety in the small fuse industry. SMD Fuse can be classified by size as 0402, 0603, 1206, and by performance as fast melting type, slow melting type, and enhanced melting heat type. SMD Fuse are widely used in various fields such as computer peripherals, mobile communication devices, digital cameras,monitor, and new energy vehicles.
NOx sensor
High quality flat chip is made using HTCC (High Temperature Co fired Ceramic) technology. The chip integrates multi-layer sensing elements with heaters, which can maintain accurate measurement performance even after long-term use. NOx sensor chip utilizes electrochemical principles to accurately measure the NOx content in automobile exhaust by measuring the current, and is mainly used in commercial vehicle NOx sensors.
Electrostatic suction cups
Ceramic electrostatic suction cups are mainly composed of three parts: dielectric adsorption layer, electrode layer, and substrate layer stacked in a layered structure from the surface to the inside. The dielectric adsorption layer is located on the surface and is used to achieve efficient adsorption. The electrode layer is located in the middle and forms an electrostatic field by applying positive or negative voltage, while the substrate layer plays a supporting and fixing role. In addition, auxiliary structures such as electrode columns, gas channels, and bonding materials can be embedded inside the electrostatic suction cup. The gas can be introduced into He gas during operation, and heat transfer can be carried out through gas circulation flow to stabilize and control the temperature of the wafer.
2. The film thickness difference in the pattern area is ≤ 2 μ, and the resistance values in each area are consistent;
3. The surface of the emulsion will be specially treated to effectively control ink overflow.
Thick film heating
Thick film heating refers to the use of screen printing technology to print insulating dielectric, resistive, conductive, protective glaze and other materials on a substrate, which are then sintered at high temperatures. Thick film refers to a film layer formed on a substrate using printing and sintering techniques, with a thickness ranging from a few micrometers to several tens of micrometers. The disadvantage of thick film heating technology is that the thermal conduction distance from the resistance heating layer to the stainless steel substrate is short, and the thermal resistance is small.
Thick film circuit
Thick film circuit refers to an integrated circuit composed of a passive network fabricated using array film technology (silk screen process, sintering, electroplating, etc.) on the same substrate and assembled with discrete semiconductor devices, single-chip integrated circuits, or micro components. It is generally believed that films with a thickness of several micrometers to tens of micrometers are thick films, and the materials used to make thick films are five types of pastes: conductors, resistors, dielectrics, insulation, and encapsulation. Thick film integrated circuits have simple manufacturing processes, low costs, and the ability to withstand high power, but there are certain limitations in the types and numerical ranges of components they produce.
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