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Flexible Circuit Industry

Professional supplier of electronic screen printing solutions

COF

FPC

FSR

COF

It is a grain soft film assembly technology that fixes integrated circuits (ICs) on flexible circuit boards. It uses soft attached circuit boards as packaging chip carriers to combine chips with soft substrate circuits, or refers to soft attached circuit boards that do not package chips. This includes tape packaging production (TAB substrate, the process is called TCP), soft board connection chip components, and soft IC carrier board packaging.

NPR-3800 Insulation Ink

1.Ink with excellent insulating properties
2.2-liquid Ink with mixing of main agent and hardener
3.Heat curing Ink

COF chip package

1. 3D steel wire mesh composite process production;
2. The special processing technology of mesh ensures stable screen printing size;
3. Screen pattern size accuracy ± 20 μm.

Bando S-Type

The Bando S-type squeegee differs from ordinary polyurethane squeegees in that it is made from special rubber with a distinctive "odor." It has excellent corrosion resistance to certain specialized inks.

FSR

Flexible Pressure Sensors

1. Composite steel wire mesh, with high-resolution emulsions applied to dense lines;
2. Special process to eliminate moiré patterns;
3. The printing edges are neat and exhibit good ink-passing performance.

UD Composite squeegee

1. The squeegee is an integrated casting process, providing superior solvent and wear resistance;
2. The double-layer design with varying hardness offers enhanced support, ensuring more consistent film thickness for prolonged printing;
3. The white section has a hardness of 95 degrees, while the blue section features hardnesses of 65 degrees, 70 degrees, 75 degrees, and 83 degrees.

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+86-18015055391

Mail:Eric@plet.cn
Address: Building 11, No.16 Luofushan Road, Luoxi Town, Xinbei District, Changzhou City

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