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Phenolic Resin (KT-BN3 & KT-BN4) Series Carbon Paste
- Commodity name： Phenolic Resin (KT-BN3 & KT-BN4) Series Carbon Paste
Classification:
Keywords: Squeegee | Screen | Ink
These resins are characterized by a relatively high drying temperature (150°C) and are typically used in applications that demand high heat resistance and superior performance.
1. KT-BN3 (Bubble-Improved Product)
Core purpose: It is used in screen printing to produce resistive films and represents an improved version that addresses the bubble-related issues encountered in previous formulations.
Specification breakdown:
KT-BN3 2.5 kΩ (low resistance): Measured resistance is 5.86 kΩ; converted value at 10 μm is 2.35 kΩ; viscosity is 80 dPa·s; film thickness is 0.40 μm; adhesion is satisfactory.
KT-BN3 HR (High Resistance): Measured resistance is “infinite” (i.e., an insulator), with a viscosity of 80 dPa·s.
Curing conditions: 150°C / 30 minutes.
Diluent: BCA (Butyl Carbitol Acetate), CAS No.: 124-17-4.
Screen printing: 200 mesh/25 µm
2. KT-BN4 (Resin Variant)
Core purpose: Although both are phenolic resins, their resin formulations differ to tailor performance characteristics such as adhesion and chemical resistance.
Specification breakdown:
KT-BN4 2.5 kΩ (low resistance): Measured resistance of 6.50 kΩ; converted value at 10 μm is 2.42 kΩ; viscosity of 80 dPa·s; film thickness of 0.4 μm; adhesion rating: OK.
KT-BN4 HR (High Resistance): Measured resistance is “infinite” (i.e., an insulator), with a viscosity of 80 dPa·s.
Curing conditions: 150°C / 30 minutes.
Diluent: BCA (Butyl Carbitol Acetate), CAS No.: 124-17-4.
Screen printing: 200 mesh/25 µm
It is widely used in the manufacturing of electronic components, thin-film circuits, sensors, printed circuit boards (PCBs), and other fields, where precise resistive layers are formed via screen-printing processes.
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